Asus DUAL-RX6600-8G

ASUS Dual Radeon ™ RX 6600 8 GB GDDR6 je vyzbrojený tak, aby rozdeľoval framy a udržiaval zdravý chod CPU.

Axiálna technológia ventilátora ponúka menší náboj ventilátora, ktorý uľahčuje predĺženie lopatiek a bariérový krúžok, ktorý zvyšuje tlak vzduchu smerom nadol.

Dvojité ložiská s guľôčkovým ventilátorom môžu vydržať až dvakrát dlhšie ako konštrukcie s valcovými ložiskami.

Technológia Auto-Extreme využíva sa na zvýšenie spoľahlivosti a automatizáciu.

A ochranné backplate zabraňuje poškodzovaniu PCB komponentov.

Graphic Engine

Radeon RX 6600

Bus Standard

PCI Express 4.0

OpenGL

OpenGL®4.6

Video Memory 8GB GDDR6

Engine Clock

• OC mode : up to 2491 MHz (Boost Clock)/up to 2064 MHz (Game Clock)
• Gaming mode : up to 2491 MHz (Boost Clock)/up to 2044 MHz (Game Clock)

Stream Processors 1792

Memory Speed 14 Gbps

Memory Interface 128-bit

Resolution

Digital Max Resolution 7680 x 4320

Interface

Yes x 1 (Native HDMI 2.1)

Yes x 3 (Native DisplayPort 1.4a)

HDCP Support Yes (2.3)

Maximum Display Support 4

NVlink/ Crossfire Support

Yes

Accessories 1 x Collection Card 1 x Speedsetup Manual

Software

ASUS GPU Tweak II & Drivers: please download all software from the support site.

Dimensions 243 x 134 x 49 mm 9.6 x 5.3 x 1.9 inches

Recommended PSU 500W

Power Connectors 1 x 8-pin

Slot 2.5 Slot

Note

• Our wattage recommendation is based on a fully overclocked GPU and CPU system configuration. For a more tailored suggestion, please use the “Choose By Wattage” feature on our PSU product page: https://rog.asus.com/event/PSU/ASUS-Power-Supply-Units/index.html
• Crossfire Support for DirecX® 12 and Vulkan®
• ‘Game Clock’ is the expected GPU clock when running typical gaming applications, set to typical TGP (Total Graphics Power). Actual individual game clock results may vary.
• ‘Boost Clock’ is the maximum frequency achievable on the GPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads.